Careers

COMPANY:  

Ai Linear’s objective is to serve the ‘Distributed Intelligence’ market by providing integrated circuits (IC) end-to-end solutions (including software) that low-power, low-latency, safe, private computation free from the Cloud. Incorporated in 2020, Ai Linear is an Integrated Circuits (IC) start-up company founded by veteran design engineers in Silicon Valley. We have 33+ U.S. patents (27 issued, 6 pending) on a family of fundamental building blocks covering analog/mixed-mode low-power machine-learning technologies. Our goal is to drive innovation that creates a smarter and a better-connected world. Our vision is that Distributed Intelligence will be everywhere (Asleep-Yet-Aware), in and near SENSORS, to quietly help people, the environment, industries, and things to stay SAFE, HEALTHY, and EFFICIENT, and to unleash unimaginable NEW CAPABILITIES.   In order for Ai Linear’s vision of ‘distributed intelligent’ to materialize, our continued innovation is aimed for software programmable system-on-a chip (both analog, digital, algorithms, and software) that can provide the relevant intelligence to particular classes of sensed information (e.g., sound, waves, vibration, etc.) with configurability and programmability before the information is digitized, and before it is transmitted.  If you share this vision, then join us (send resume to ali@ailinear.com)

 

POSITION:

Vice President of Analog IC Design

 

RESPONSIBILITIES:

  • hands-on VP research and development of analog mixed-mode Machine Learning (ML) integrated circuits targeting smart sensing IoT applications including but not limited to medical, industrial automation, robotics, and drone applications.
  • Innovative role to solve technical problems, develop new sensing solutions that leverage in-depth analysis of analog signals among various front-ends (e.g., amplifiers, filters, AGC, mixers, switches, ADC, DAC, analog ML, etc.)
  • Transform ASIC/SoC mixed-mode and digital solutions, including software, from ideas into products from inception to release to production
  • Work closely with customers, suppliers (e.g., sensor, MEMS), product marketing, software/algorithm, digital IC design, CAD, and test and product engineering

REQUIRED QUALIFICATIONS:

  • PhD or Master’s Degree in EE/CE (Mixed Signal Processing/Circuit Design)
  • Experience in several successful analog and mixed-mode ASIC products from concept to silicon release to production
  • In-depth circuit-level understanding of analog front ends for various sensor interfaces, and the signal chain from sensors and transducers to digital systems such as embedded DSPs and MCUs
  • Experience in architecting/designing ultra-low power mixed-signal sensing applications including design and verification, modeling for optimal analog-digital partitioning, cost/power optimizations, etc.
  • Ability to operate within a lab to take bench measurements and debug hardware components at the IC and PCB level, e.g., analyzing analog and digital signals using lab equipment
  • Experience in working with customers and product marketing from inception to analog and digital design, and CAD teams to release GDSII tape to fabrication through test, and product engineering teams to release chips to production

  • Good organization; written and verbal communication skills

PREFERRED QUALIFICATIONS

  • Knowledge of machine learning (ML)
  • Experience in hands-on integrated circuits logic design, functional, and Power, Performance, Area (PPA) closure
  • Machine Learning (ML) and related programming skills, e.g., in Python, MATLAB, C/C++
  • Experience in code review, testing, and refactoring
  • Good understanding of embedded CPU architecture such as ARM core/RISC-V core on: processing units, ISAs, pipelining, bus architectures as well as embedded memory components such as SRAM, and Non-Volatile Memory (EEPROM) from circuit and architecture perspective
  • Skillful on data statistical analysis, aggregation, abstraction with knowledge of common ML frameworks
  • Contribute to design methodology, libraries, and code review.

POSITION:

Analog IC Design Engineer

 

RESPONSIBILITIES:

  • Perform Analog and Mixed-Mode IC design in CMOS
  • Drive layout/CAD to GDSII release
  • Work with analog, digital, and software teams to implement analog/mixed-signal circuits from initial definition and concept to full-production
  • Document IP design, define test production/bench-level test/characterization plans, and conduct design reviews with team to demonstrate that the design meets specification

REQUIRED QUALIFICATIONS:

  • BS or MS in EE (Mixed Signal Processing/Circuit Design) and 3+ years of experience in analog and mixed-mode circuit design
  • Experience and knowledge of design and validation (e.g., worst-case, monte-carlo, temperature, and power supply simulations and CAD tools such as Cadence, Synopsys, Mentor Graphics, etc.) of ultra-low power voltage and current references (bandgap and CMOS), amplifiers, comparators, switch capacitor filters, DACs, ADC (SAR, FLASH, sigma-delta, etc.), and analog machine learning.
  • Hands-on knowledge of analog concepts such as device sensitivities, offset and drift mismatch mitigation, linearity, AC and transient stability, low leakage, low-power and low-noise techniques
  • IC design and development skills from definition to high-volume production release including design for manufacturability, test planning, layout supervision, debugging and lab testing (skills with lab equipment and data analysis), product engineering evaluation and characterization
  • Good organization; written and verbal communication skills

PREFERRED QUALIFICATIONS

  • Hands-on knowledge of analog IC design and verification tools
  • Knowledge of MOSFET device level, transistor level circuit design, and analog IC design fundamentals.
  • Contribute to design methodology, libraries, and code review
  • Knowledge of machine learning (ML)

POSITION: 

Product Marketing/Application Engineer

 

RESPONSIBILITIES: 

  • Investigate and identify opportunities with sensors and use cases in ultra-portable, always on, always sensing for distributed intelligence applications ranging from IoT, machine learning, and smart sensing in medical wearables, to drones, ultra-portable robotics, utility and industrial monitoring, agriculture, and defense applications. 
  • Upon identifying target application, defining ICs all the way through design, debugging, solving problems, evaluation, qualification, and sales. 
  • Being a bridge between Ai Linear and customers, the product marketing team to manage the early sales process, including interfacing with key decision makers at the customer site, and coordinating sales demos, trade shows, documentation, scheduling, budgeting, forecasts, and post-sales support, e.g., failure and quality test analysis.
  • The product marketing team members must have the skills to perform IC lab-work to test and answer customers’ technical questions to help close deals. The position requires travel to customer sites as needed. 

REQUIRED QUALIFICATIONS:

  • BSEE, and 3+ years of IC product marketing
  • Knowledgeable about sensors, embedded systems, analog & digital design fundamentals and tools, schematic and printed circuit board layout
  • Interface, adapt, collaborate with customers, travel (25%+) to solve problems, win designs, and make sales
  • Promotion and demonstration of AI Linear solutions at target customers
  • Training customers on AI Linear software and hardware solutions
  • First line technical support for target customers; from initial contact through to deployment
  • Identify and understand technical trends and clearly communicate recommendations for future products product requirements
  • Good organization; written and verbal communication skills

PREFERRED QUALIFICATIONS

  • Experience in Software (C/C++, Python/Octave/Matlab)
  • Experience in Systems Hardware design, protocol, and debug with wireline interface (e.g., USB, SPI, UART, I2C, I2S) as well as wireless interfaces (e.g., BLE, 802.15.4, Wi-Fi) and IoT interfaces (e.g., MQTT).
  • Experience with embedded Digital Signal Processing (e.g., machine learning signal processing and optimizations)
  • Experience with Sensor applications (e.g., sound/wave/audio/voice, vibration monitoring, touch/proximity, bio-sensing).
  • Experience with embedded systems hardware and software design
  • Ability to think and act strategically
  • Experienced with the git version management system
  • Proficient in Microsoft productivity tools (Word, Outlook, PowerPoint, Excel etc.)
  • Ability to handle complex technical support cases. Providing an efficient interface between the customer and AI Linear Engineering. That includes supporting customers with debugging and ensuring they provide sufficient information to reproduce the problem.
  • Highly motivated and passionate individual that is able to learn on the job and work independently

POSITION: in USA

  • Analog IC Design Intern

  • Digital IC Design Intern

 

INTERNSHIP PERIOD:

  • Flexible (full-time summer internship & part-time school year internship)

REQUIRED QUALIFICATIONS:

  • Must be pursuing an MS or BS (senior year) degree in Electrical Engineering
  • Good organization; written and verbal communication skills

PREFERRED QUALIFICATIONS

  • Foundational knowledge of CMOS analog and digital IC design
  • Ability to perform simulations and verification of CMOS analog and digital ICs
  • Competency in simulation and CAD tools (Synopsys, Cadence, Mentor Graphics)

POSITION:

RTL Digital Design Engineer

 

RESPONSIBILITIES:

  • Develop ultra-low power hybrid (analog & digital) IoT interface chips, architecture through production
  • Develop functional specifications, coordinate on functional test plans, develop RTL behavioral code and debug, logic synthesis and timing, assist with floor planning, place & route, back-end IC checks, production engineering, post-silicon debug
  • Work with CAD/CAE/DV teams to develop design tools and automation infrastructure

REQUIRED QUALIFICATIONS:

  • BSEE/CS or higher and 5+ years of hands-on digital CMOS IC/SoC Design experience 
  • Demonstrated ability to develop digital ICs to tape out
  • Deep familiarity with either Verilog and/or System Verilog RTL development including logic synthesis and static timing analysis
  • Good organization; written and verbal communication skills

DESIRED QUALIFICATIONS:

  • Top-level digital architecture capability including contributions to design specification, process/IP selection, and design partitioning
  • Knowledge of digital designer verification, both UVM and/or formal (e.g., Jasper)
  • Knowledge of floor planning, automated place & route, CTS, LVS, DRC
  • Knowledge of IC product testing (ATPG, JTAG, MBIST, LBIST)
  • Knowledge of both Bulk and FinFet CMOS processes, Spice analysis thereof
  • Ultra-low power digital design techniques, including clock and power gating

 POSITION:

Design Verification Engineer

 

RESPONSIBILITIES:

  • Test plans, test bench construction & test vector construction  
  • Use Synopsys Verdi or Cadence vManager to keep track of functional coverage.  
  • Collaborate with Software, Systems, Analog, and Applications Engineers to meet customer needs.
  • Collaborate with product engineers to design-for-test, including test insertion (e.g., scan, JTAG, MBIST) and test pattern generation.

REQUIRED QUALIFICATIONS:

  • BSEE/CS or higher and 3+ years of hands-on digital CMOS IC/SoC Design experience
  • Experience with System Verilog and UVM verification methodology
  • Good organization; written and verbal communication skills

DESIRED QUALIFICATIONS:

  • Strong scripting skills (Python or Perl)
  • Experience with FPGA-based emulation and/or Cadence Palladium. 
  • Experience with Cadence Jasper (formal).
  • Experience with bug tracking tools such as Atlassian Jira

POSITION:

Back-End Digital Design Engineer

 

RESPONSIBILITIES:

  • Floorplan, place & route hybrid (analog & digital) chips
  • LVS/DRC/ERC silicon signoff, LEC behavioral vs. gate, electrical signoff (IR drop, antenna, cap fill, etc.)
  • Work closely with layout designers as needed
  • Work closely with Product Test engineers to develop production test plan
  • Work closely with Packaging Engineers to plan package design. 
  • Release GDS2 to Foundry 

REQUIRED QUALIFICATIONS:

  • BSEE/CS or MSEE/CS and 5+ years of hands-on back-end digital Design experience (having released digital ASICs/SoCs to production). 
  • Demonstrated ability to floorplan, place, & route digital chips.
  • Experience with both LVS, DRC, ERC, and LEC tools
  • Experience with Verilog gate-level modeling.
  • Good organization; written and verbal communication skills

DESIRED QUALIFICATIONS:

  • Good background with RTL-to-GDS flow (either Synopsys, Cadence, or Mentor)
  • Ultra-low power digital design techniques, including clock and power gating
  • Clock tree routing, scan chain routing
  • SPEF generation

POSITION:

Product Test Engineer

 

RESPONSIBILITIES:

  • Implement production test programs (DFT) and hardware (probe cards, load boards, sockets, ATC) for wafer probe and package test utilizing ATE equipment 
  • Work with Design to translate concepts to product testing requirements, develop documentation, load board and socket design specifications, and ATE final test programs
  • Design IC test vectors for Power/Voltage/Temperature (PVT) corners, signal and power integrity characterization and participate in silicon debug, electrical failure analysis (EFA) and physical failure analysis (PFA)
  • Work on wafer and package level test hardware and software development and bring up offshore test house by completing necessary correlation analysis
  • Establish manufacturing requirements and specification for delivery of the product and drive to close potential test gaps and correlations issues across the product supply chain

REQUIRED QUALIFICATIONS:

  • BSEE or higher
  • 4+ years of experience in DFT, wafer probe card design, ATE hardware design, strong physical design and signal integrity experience on ATE load board/probe card design.
  • Good organization; written and verbal communication skills

DESIRED QUALIFICATIONS:

  • 4+ years of experience with scripting (C, C++, Python or Perl)
  • 4+ years of experience with probability and statistical fundamentals for data analysis using tools such as JMP
  • 4+ years of experience developing presentations for vendor and partner